Hardware Configuration
Technical Parameter
Product Description
PLC: MITSUBISHI Motor: TaiWan Solid state: AUTONICSTouch screen: weinview Communication: MITSUBISHI Thermostat: RKCMaximum processing size: 630 mm×730mm Minimum processing size: 350mm×400mm Board thickness range: 0.8-4.0mmTemperature uniformity: ±2℃ Suspension step: 70 type, 80 type optional Baking method: high-speed circulating hot airTemperature range: normal temperature -180℃ Exhaust air volume: 6-8m/s Networking signal: Ethernet port dockingProduct Performance
1,Adopt patent heating system, energy saving 30% 2,Adopt high-speed circulating fan, equipped with patented wind wheel to transport wind 3,Control panel with color man-machine interface, easy to manage the output and the operation of error elimination. 4,Multi-stage modular heating section, each independent furnace unit can be added or shortened in the future, keeping production requirements more flexible. 5,The unique cold air circuit in the cooling section can reduce the temperature to room temperature when the board is ejected to ensure that the subsequent process can be carried out 6,There is a maintenance door design, which is convenient for future cleaning and maintenance. 7,Conveyed by metal gears, running smoothly,customized rock type. 8,Energy-saving mode: energy-saving control mode with automatic heating/off heating 9,With 2 sets of over-temperature indication and alarm function 10,Imported high temperature silicic acid thermal insulation rock wool