Application
1.Imported heating system with anti-attenuation system for heating tube energy 2.Adopt high-speed circulating fan, equipped with patented wind wheel to transport wind 3.Multi-stage modular heating section, each independent oven unit can be added or shortened in the future, keeping production requirements more flexible. 4.The unique cold air circuit in the cooling section can reduce the temperature to room temperature when the board is ejected to ensure that the subsequent process can be carried out 5.There is a maintenance door design and chain system, which is convenient for future cleaning and maintenance. 6.Conveying by rollers, running smoothly 7.Energy-saving mode: energy-saving control mode with automatic heating/off heating 8.With over-temperature indication and alarm function，higher safety factor 9.Imported high temperature silicic acid thermal insulation rock woolHardware Configuration
Technical Parameter
Product Performance
PCB, BGA, FPC, COF, Display, Touch Panel, Back Light, Solar Cell, Smart Card, Optical Film, Battery ,Garment and Semiconductor industries.PLC: MITSUBISHI Motor: TaiWan Solid state: AUTONICSTouch screen: weinview Heating tube: GER Thermostat: RKCMaximum processing size: 630 mm×730mm Minimum processing size: 350mm×400mm Board thickness range: 0.4-4.0mm Temperature uniformity: ±5℃Conveying width: 60 type, 70 type, 80 type can be selected Baking method: high-speed circulating hot air + infrared drying Function selection: single/double-sided baking option External dimensions:customrizedTemperature range: normal temperature -220℃ Exhaust air volume: 6-8m/s Networking signal: Ethernet port docking